Semiconductor encapsulant
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What is semiconductor encapsulant for advanced semiconductor packaging?
Semiconductor encapsulants are materials that protect semiconductor chips from light, heat, moisture, dust, and shock. Typically, materials are in liquid, film, and granule form. The encapsulation materials provided by AFT are being considered for application to fan-out wafer-level packaging (FO-WLP) and fan-out panel-level packaging (FO-PLP).
| Encapsulant | WLP application | PLP application | Features |
|---|---|---|---|
| Liquid (general) | ✔︎ |
+ High liquidity
- Flow mark  |
|
| Film (general) | ✔︎ | ✔︎ |
+ Handling
 |
| Granule | ✔︎ | ✔︎ |
+ No flow marks
- Equipment contamination by droplets  |
Have you experienced any of these issues?
Need material that offers low warpage along with other properties
case
01
Want to try both high and low elasticity
case
02
Need peel- and crack-resistant material
case
03
Here are two products that resolve these issues.
| 1) Liquid encapsulant | 2) Film type encapsulant | |
|---|---|---|
| AFT | ++ Good resin flow. Applicable to molded underfill (MUF) + Less flow mark + Low warpage, low thermal expansion coefficient + Support various inorganic fillers, from small to large particle diameter |
+ Handling + Applicable from thin film + Low warpage, applicable from thin film + Applicable to various inorganic fillers, from small to large particle diameter |
| General | + High liquidity - Flow mark - Compatibility with FO-PLP |
＋ Handling |
Added value
Examples and Applications
Liquid encapsulant
Large-area batch sealing is possible mainly with compression molding equipment.
Film encapsulant
High throughput and large-area batch sealing are possible primarily through vacuum lamination.
Completion rendering
Liquid encapsulant
Wafer level package
Film encapsulant
Panel level package
General fan-out package
