PLENSETTM
PLENSETTM
Developing products
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What are PLENSETTM developing products?
1) In addition to the conventional property of low-temperature curability - the core technology -
we are continuing to examine and explore ways to further augment the characteristics.
Please let us know about
the characteristics you require.
2) We are always open to receiving requests from you concerning adhesives. If
there is a particular functionality that is not available in our current products, we will continue to work on
developing it.
For instance, we are currently taking a close look at a transparent and thermally conductive
type.
Have you experienced these issues?
High-performance, high-transparency adhesives and
encapsulants
case
01
Efficient dissipation of heat
case
02
Please let us know if there are any other characteristics that you
would like us to combine with low-temperature curability.
case
03
Here is the product that resolves these issues. PLENSETTM Developing products
Core
technologyLow-temperature curability
＋
Functionalization
Creation of new value
TransparencyProvides cured material with high
transparency
Low temperature curing type and UV curing type are available.
High resistance to UV yellowing
Low temperature curing type and UV curing type are available.
High resistance to UV yellowing
Feature
#1
Thermal conductivityBoth low-temperature curing
and thermal conductivity
Can be cured at 80degC for 30 minutes
High-adhesion, low-elasticity type => Superior drop impact resistance
Can be cured at 80degC for 30 minutes
High-adhesion, low-elasticity type => Superior drop impact resistance
Feature
#2
Characteristics
| Item | LT Series | Conditions | ||
|---|---|---|---|---|
| Feature | Low-temperature curability | ー | ||
| Characteristics | Color tone and appearance | Yellow white viscous liquid | Visual inspection | |
| Viscosity | 47Pa･s | E-type viscometer 25degC,20rpm |
||
| Thixotropic index | 1.0 | E-type viscometer 25degC,2rpm,20rpm |
||
| Standard curing conditions | 80degC×30minutes | Hot air circulation oven | ||
| Properties of cured material | Light transmittance | 800mm | 93% | Spectrophotometer 100 μm thickness conversion |
| 350mm | 90% | |||
| Refractive index | 1,55 | Abbe refractometer | ||
| Tensile lap shear strength | 2.1N/㎟ | JIS K-6850 (PC) | ||
| Item | FT Series | Conditions | |
|---|---|---|---|
| Feature | Flexibility | ー | |
| Curing agent | Color tone and appearance | Black viscous liquid | Visual inspection |
| Viscosity | 24-50Pa･s | E-type viscometer 25degC,20rpm |
|
| Thixotropic index | 2.6 | E-type viscometer 25degC,2rpm,20rpm |
|
| Standard curing conditions | 80degC×60minutes | Hot air circulation oven | |
| Properties of cured material | Tharmal conductivity | 1.3-2.0W/mK | Hot-disk method (25degC) |
| Tensile lap shear strength | 21N/㎟ | Nickel plating | |
| 13N/㎟ | LCP | ||
The data in this document are representative values, not standard values.
The contents of this document are subject to change without notice.
Application process
Telephone or form inquiry
Inquire about customer issues, required
characteristics
Propose and send samples for
evaluation
Customer evaluation
Interview regarding results of
evaluation
When it is difficult to use existing
products
Consultation and consideration of development
themes
