PLENSETTM
Adhesives & EncapsulantsTM
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About PLENSETTM
PLENSETTMis a one-component epoxy resin adhesive created based on the advanced
latent hardener technology that Ajinomoto Fine-Techno has cultivated over many years.
This product
employs a unique curing system using heat curing, UV curing, and combined UV/heat curing, and boasts
performance that sets it apart from other adhesives.
PLAIN SETTM achieves advanced properties
that conventional adhesives could not, demonstrating its capabilities in a wide range of applications such
as high-precision electronic components like camera modules, semiconductor packaging, and automotive
electronics.
Its advantages are particularly notable in the assembly of precision electronic components
and products where reliability is crucial.
These features not only enhance adhesive performance but also
significantly contribute to product reliability and process improvement.
Issues with industrial adhesive and encapsulating materials
Curing at lower temperatures
case
01
Relieving stress and bending
case
02
Pouring into narrow spaces
case
03
Encapsulating or protecting gas
case
04
Applying it in situations that demand reliability
case
05
Using it as a replacement for solder
case
06
Temporarily fixing
case
07
Dissipating heat
case
08
Applying it to transparent parts
case
09
Application
Smartphones
Hard disk drive
Other electronic devices
Optical communication
Smartphones
Vibration devices
Camera
Display
Various sensors
Facial recognition
Benefits of introduction and features
The specific benefits and features of introducing PLENSETTM are as follows:
・Low-temperature curing
PLENSETTM has the
characteristic of curing at low temperatures below 80degC. This makes it highly suitable for assembling electronic
components that contain many heat-sensitive materials. Furthermore, the
low-temperature curing prevents component degradation due to high temperatures, thereby improving the overall
reliability of the product.・Rapid curing speed
PLENSETTM can cure at even lower temperatures, achieving very short curing
times of just a few seconds at relatively low temperature ranges such as 120degC or 150degC. This
significantly enhances the efficiency of the manufacturing process and maximizes the throughput of the production
line.・Stress relaxation effect
Because it cures at low
temperatures, it effectively relaxes the stress that occurs due to the
contraction of materials during cooling. This minimizes the stress between bonded materials, ensuring long-term
product reliability and durability.
Resolve your issues with Ajinomoto Fine-Techno's core technologies
Product features and lineup
Insulation properties
Low temperature curing type
- Unmatched low-temperature curing capability
- Low-temperature curing prevents warping and deformation
- Adhesion to heat-sensitive and precision parts
Drop impact resistance type
- Low-temperature curing at 80degC for 30 minutes
- Low elasticity enables superior stress alleviation and drop impact resistance
- Adhesion to dissimilar materials and vibration suppression
No particle type
- Powder-free no particle type
- Impregnation bonding to narrow gaps possible
- Adhesive thickness reduced to surface roughness level
Narrow gap curing type
- Encapsulation possible even with narrow gaps and minute amounts of coating without uncured separation
- Application of no particle curing system
High reliability type
- Applications demanding higher reliability in terms of adhesiveness, toughness, and moisture resistance
- Fast curing at high temperature
- Applications for optical communication, 5G communication, in-vehicle equipment, and more
Gas barrier type
- Encapsulation possible even with narrow gaps and minute amounts of coating without uncuring separation
- Protective encapsulation against water vapor and other gases
Hybrid UV heat curing type
- Temporary fixing possible with UV
- Low temperature curing (80degC) by heat is possible for areas not irradiated by UV
Conductivity
Electrically conductive type
- Low-temperature curing at 80degC for 60 minutes
- Connection with heat-sensitive components
- Galvanic corrosion inhibition, solder alternative
- Application to wearables and flexible printed circuit boards (FPCs)
Developing products
Thermally conductive type
- Compatibility of low-temperature curing and thermal conductivity. Curing possible in 30 minutes at 80degC
- Has flexibility curable 30minutes at 80degC => Superior drop impact resistance
under development
Transparent type
- Highly transparent cured material
- Low-temperature curing at 80degC for 30 minutes
- High resistance to UV yellowing
under development
Examples and Applications
Due to the excellent properties of PLENSET™, the following specific use cases can be
cited:
Suppression of magnetic force reduction:
Neodymium magnets
are weak against high temperatures, and their magnetic force decreases when the heat resistance temperature is
exceeded. However, PLENSETTM can cure at a low temperature of 80degC,
ensuring reliable adhesion while minimizing the reduction of magnetic force. This maintains the reliability of
devices that use high-performance magnets.High drop impact
resistance:
PLENSETTM combines high flexibility and strong
adhesion, making it highly suitable for products where drop impact resistance is crucial, such as mobile
devices. This property protects products from drops and impacts, enhancing their durability.Application of conductive types:
For electrical connections of
components that are weak against high temperatures and difficult to process with reflow, applying the conductive
type of PLENSETTM ensures highly reliable connections. This property enables product designs that
exhibit stable electronic functions even under harsh conditions.
Application process
Telephone or form inquiry
Inquire about customer issues, required
characteristics
Propose and send samples for
evaluation
Customer evaluation
Interview regarding results of
evaluation
When it is difficult to use existing
products
Consultation and consideration of development
themes
