Adhesives & EncapsulantsTM
About PLENSETTM
PLENSETTM is a one-component epoxy resin adhesive based on the latent curing agent technologies that Ajinomoto Fine-Techno has accumulated over the years.
Our proprietary curing system makes possible the unique features described below, and plays an important role in various fields such as camera modules and other precision electronic components, semiconductor packaging, and car electronics.
Issues with industrial adhesive and encapsulating materials
Application
Benefits of introduction and features
Since it has curing capability at 80degC and below, it is suitable for assembling electronic components that incorporate heat-sensitive materials.
Low-temperature curing capability enables curing in a few seconds at 120degC or 150degC.
Low-temperature curing capability alleviates stress caused by the shrinkage of the material during cooling.
Resolve your issues with Ajinomoto Fine-Techno's core technologies
Product features and lineup
Insulation properties
- Unmatched low-temperature curing capability
- Low-temperature curing prevents warping and deformation
- Adhesion to heat-sensitive and precision parts
- Low-temperature curing at 80degC for 30 minutes
- Low elasticity enables superior stress alleviation and drop impact resistance
- Adhesion to dissimilar materials and vibration suppression
- Powder-free no particle type
- Impregnation bonding to narrow gaps possible
- Adhesive thickness reduced to surface roughness level
- Encapsulation possible even with narrow gaps and minute amounts of coating without uncured separation
- Application of no particle curing system
- Applications demanding higher reliability in terms of adhesiveness, toughness, and moisture resistance
- Fast curing at high temperature
- Applications for optical communication, 5G communication, in-vehicle equipment, and more
- Encapsulation possible even with narrow gaps and minute amounts of coating without uncuring separation
- Protective encapsulation against water vapor and other gases
Conductivity
- Low-temperature curing at 80degC for 60 minutes
- Connection with heat-sensitive components
- Galvanic corrosion inhibition, solder alternative
- Application to wearables and flexible printed circuit boards (FPCs)
Developing products
- Temporary fixing possible with UV
- Low temperature curing (80degC) by heat is possible for areas not irradiated by UV
- Compatibility of low-temperature curing and thermal conductivity. Curing possible in 30 minutes at 80degC
- Has flexibility curable 30minutes at 80degC => Superior drop impact resistance
- Highly transparent cured material
- Low-temperature curing at 80degC for 30 minutes
- High resistance to UV yellowing
Examples and Applications
The ability to cure at 80degC, which is lower than the heat resistance temperature of neodymium magnets, enables adhesion with minimal loss of magnetic force.
Its flexibility and high adhesiveness afford it the superior drop impact resistance required for mobile devices.
The electrically conductive type is applied to electrical connections for parts that cannot be reflowed due to the heat resistance of the parts.
Application process
